Printed circuits
- From the prototype to mass production
- Soldermask and marking made with inks in a wide range of colours
- Peelable soldermask
- « front panel » silk-screening possible on the opposite side of the circuit: with multiple colours and graining
Single sided circuits
- Materials FR4, CEM1, IMS
- Making flexible circuits ( copper on polyester )
- Making circuits with silver plated straps
Double sided circuits without metallization
- Materials FR4, CEM1
- Making of circuit with conductive ink filled vias
Annecy Electronique’s Technical Means
Cutting–Drilling
- 3 machines with 4 CNC PLURITEC heads
- 1 machine CNC PLURITEC MINIMA
- Internal and external cutting in every possible shape
- Partial clipping with attaching points
- Making bevels on the board’s edges
Grooving
- 1 grooving machine with digital controls
- All materials
- Ideal for panelization of circuits
- Without distance constraints between grooves
- On thin materials (e.g. 0.4 mm FR4)
Specific treatments of photographic data
- 1 phototracer 1000/2000 DPI
- In-house marking-out of all films constituting the internal folder (originals given to client on request)
- Treated files: GERBER - DPF HPGL (depending on version).
- Computing tools for Document Management and Client Management
- Panelization; creating files to make masks for the soldering paste (on request)
- Storage and back-up copies of all clients and production data.
Circuit finish
- Surface treatment in conformity with EU Directive RoHS
- Tin plating with led-free alloy rollers; done in-house
- Outsourcing : HAL tin plating, Nickel, Nickel-Gold, Nickel-Rhodium or Palladium
- Any special treatment on request
Treated materials on stock
| Materials | Thickness on stock | Copper thickness |
|---|---|---|
| CEM1 | 1,6 mm | 35 µ - 70 µ |
| FR4 | 0,2 - 0,3 - 0,4 - 0,5 - 0,8 - 1,0 - 1,2 - 1,6 - 2,0 - 2,4 - 3,2 mm | 18 µ - 35 µ - 70 µ - 105 µ |
| POLYIMIDE | 1,6 - 2,4 mm | 35 µ |
| SMI | 1,6 mm | 35 µ - 70 µ |
| POLYESTER | 125 µ | 18 µ à 105 µ |